上海柏斯高微电子工程有限公司 main business:引线框架，模具 and other products. Company respected "practical, hard work, responsibility" spirit of enterprise, and to integrity, win-win, creating business ideas, to create a good business environment, with a new management model, perfect technology, attentive service, excellent quality of basic survival, we always adhere to customer first intentions to serve customers, persist in using their services to impress clients.
welcome new and old customers to visit our company guidance, my company specific address is: 上海市市辖区浦东新区高行镇浦东新区杨高中路3658号.
If you are interested in our products or have any questions, you can give us a message, or contact us directly, we will receive your information, will be the first time in a timely manner contact with you.
- 91310115607338681E
- 91310115607338681E
- 存续（在营、开业、在册）
- 有限责任公司（外国法人独资）
- 1995-10-12
- 岑庆建
- 100.65万美元
- 1995-10-12 至 永久
- 浦东新区市场监管局
- 上海市浦东新区杨高北路3658号二幢一楼
- 生产半导体引线框架、精密模具、电子配件及专用封装切筋设备，销售自产产品并提供上述相关技术咨询（依法须经批准的项目，经相关部门批准后方可开展经营活动）。
| 序号 | 公布号 | 发明名称 | 公布日期 | 摘要 |
| 1 | CN1595405A | 塑封模CAD系统中的温度补偿方法 | 2005.03.16 | 本发明涉及微电子技术领域中一种塑封模设计制造中的温度补偿方法，特别涉及一种用于集成电路封装模具设计制 |
Map(The red dot in the figure below is 上海柏斯高微电子工程有限公司 at the specific location, the map can drag, double zoom)
